Nintendo 3DS Ready Launched

After a few weeks ago Japan hit by huge damage, due to the earthquake followed by tsunami. But Nintendo's intention to soon launch their newest product the Nintendo 3DS, on March 27, 2011.

"Although some parts of Japan were severely damaged by the tsunami, but we will launch the Nintendo 3DS and send to the world. Because of all this, our business and our product shipments are not affected significantly by far," a spokesman who declined to write his name by the editors of the New York Times.

Nintendo 3DS itself is the first portable games released by Nintendo in September. The advantages of this product itself, is a game you can play games in 3D format of the screen is very small and without using 3D glasses.

The plan, Nintendo will cost portable games that have a more simple design than the previous DS series, costing U.S. $ 249.99.

AMD Fight i7 Sandy Bridge with Bulldozer

A leaked document from AMD seen by us here claims that AMD FX-series central processing unit (CPUs) powered by the Bulldozer micro-architecture will be fully able to rival Core i7 2600-series chips.

AMD plans to introduce AMD 900-series chipsets compatible with Zambezi processors in Q2 2011. The Bulldozer processors, Radeon HD 6000 "Northern Islands" discrete graphics cards and AMD 900-series core-logic sets will power AMD's next-generation enthusiast-class platform code-named Scorpius.

The initial family of AMD's FX-series microprocessors based on Bulldozer micro-architecture will include four models with eight, six or four cores and 95W or 125W thermal design power (TDP).

The first breed of AMD FX8000, FX6000 and FX4000 currently known under Zambezi code-name will completely support all the advantages that the Bulldozer micro-architecture is supposed to bring, including new Flex FP floating point processing unit. The new chips in maximum eight-core configurations are projected - by AMD's internal documents - to offer roughly 50% performance improvement over Phenom II-series microprocessors in multimedia applications.

The primary family of AMD FX-series central processing units (CPUs) will feature two eight-core models, one six-core flavour as well as a quad-core version. The chips will support dual-channel DDR3 1866MHz memory, will support Turbo Core dynamic acceleration technology and will come in AM3+ form-factor and will have 125W and 95W TDP.

Intel Dualcore E5700

Status	Launched
Launch Date	Q3'10
Processor Number	E5700
# of Cores	2
# of Threads	2
Clock Speed	3 GHz
Intel® Smart Cache	2 MB
Bus/Core Ratio	15
FSB Speed	800 MHz
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V

ECS G41T-M12

ECS G41T-M12 motherboard supports Intel® Core 2 Quad processors and dual-channel DDR3 1066MHz with upgraded bandwidth
G41T-M12 features Intel G41 and ICH7 chipsets, by supporting Intel 45nm Core 2 Quad processors, it provides impressive performance. Additionally, G41T-M12 is equipped with 2 DIMM DDR3 1066 up to 8GB, which means good scalability and enhances the efficiency appreciably. ECS G41T-M12 brings outstanding performance without high price tag.

CPU	º LGA775 socket for Core™2 Quad/ Core™2 Duo/ Pentium® Dual Core/ Celeron® Dual Core/ Celeron® 400 series /Pentium® 4/ Celeron® D processors º LGA775 socket for latest Intel® 45nm Multi-Core processors º FSB 1333/1066/800 MHz
CHIPSET	º Intel® G41 & ICH7 º North Bridge: Intel® G41 º South Bridge: Intel® ICH7
GRAPHICS	º Integrated Intel® Graphics Media Accelerator 4500 (GMA4500) º Integrated DirectX 10 graphics processor
MEMORY	º Dual-channel DDR3 memory architecture º 2 x 240-pin DDR3 DIMM socket support up to 8 GB Due to the operating system limitation, the actual memory size may be less than 4GB for the reservation for system usage under Windows® 32-bit OS. For Windows® 64-bit OS with 64-bit CPU, there is no such limitation
EXPANSION SLOT	º 1 x PCI Express x16 slot º 1 x PCI Express x1 slot º 2 x PCI slots
STORAGE	º Support by Intel® ICH7     • 1 x Ultra DMA100/66 devices     • 2 x Serial ATA 3.0Gb/s devices
AUDIO	º VIA® VT1705 6-channel audio CODEC
LAN	º Realtek 8105E 10/100 Lan º Realtek 8111E Giga Lan (Optional)
REAR PANEL I/O	º 1 x PS/2 keyboard & PS/2 mouse connectors º 1 x D-sub(VGA) º 1 x RJ45 LAN connector º 1 x Audio port (Line-in, Line-out, Mic-in) º 4 x USB 2.0 Ports
INTERNAL I/O CONNECTORS & HEADERS	º 1 x 24-pin ATX Power Supply connector º 1 x 4-pin 12V Connector º 1 x 4-pin CPU_FAN connector º 1 x IDE connector º 1 x Speaker header º 1 x Front panel audio header º 1 x Front panel switch/LED header º 1 x SPDIF out header º 1 x Serial port header º 2 x SATA 3Gb/s connectors º 2 x USB 2.0 headers support additional 4 USB 2.0 Ports º 1 x Parallel Header º 1 x Chassis intrusion header º 1 x Clear CMOS header
SYSTEM BIOS	º AMI BIOS with 8Mb SPI Flash ROM º Supports Plug and Play, STR (S3) / STD (S4) , Hardware monitor, Multi Boot º Supports ACPI & DMI º Audio, LAN, can be disabled in BIOS º F11 hot key for boot up devices option
FORM FACTOR	º Taille Micro-ATX, 244mm*170mm

NEO POWERLOQICS Luxura 5010

A Touch of High Class Computer Case

 

PRODUCT SPECIFICATION

Structure :

• External Dimension 435 (H) x 185(W) x 415 (D) mm
• Structure Dimension 400 (H) x 180 (W) x 410 (D) mm
• Internal Dimension (motherboard area) 270 (H) x 168 (W) x 322 (D) mm
• High Quality SECC metal
• High Grade 0.5 – 0.65 mm Thickness
• Anti-Rust Metal Coating
• Back Fan : 1 x 80 mm (upgradeable to 90 mm)
• Expansion Slots : 7 slots to support multiple addon cards
• Maximum Graphics Card Long Size 280 mm (GTS Series)
• 5 pcs 5.25″ Drive bay ( 4 pcs Exposed + 1 pcs Hidden )
• 7 pcs 3.5″ Drive bay 1 pcs Exposed + 6 pcs Hidden
• M/B From Factor : Standard ATX, Micro ATX, Mini-ITX
• Excellent Front to Back Air Flow Structure system
• Tool-Free Screws for Drive Bay ( optional )

Front Panel :

• Pure ABS Front Panel
• Blue LASER Power LED
• LCD Temperature panel : No (optional for special edition)
• Front Panel Audio Interface, Line Out (speaker / headphones) + Line In (microphone)
• Front Panel USB Interface 2 x USB 2.0 Horisontal position

Side Panel :

• Side Fan optional 80 mm Fan or Air duct system
• Side Panel Big Cooling : No (120 mm – 140 mm fan optional for special edition)
• Side Panel Windowed : No (optional for special edition)
• Tool-Free Screws for side panel

Body Finishing :

• Luxurious Glossy Black with Oil Painting system for all body case
• Color Combinations : Dark Grey Metalics, White and special edition

 PowerSupply :

• Power Supply 350 Watts pure -650 Watts rated power
• Ver 1.0 P.S.U. Connector 24 (20+4) + 4 PIN power, 1 SATA, 1 FDD, 4 IDE connector
• Ver 2.0 P.S.U. Connector 24 (20+4) + 4 PIN power, 2 SATA, 1 FDD, 3 IDE connector
• Power Supply Back Fan 1 x 80 mm Noiseless

Packing :

• Retail pack Package Dimension 490(H) x 230(W) x 460 (D) mm
• Luxurious design packing with 5 mm Thickness and 2 sides Handle
• Net Weight : 4.5 kgs
• Gross Weight : 5 kgs (include retail pack)

Dazumba DV-525

dimension	:	L 376.5 x W 180 x H 413 mm w/o bezel
holder	:	2 x 5.25
usb front	:	support usb 1.0 & 2.0
audio front	:	1 audio output & 1 audio input
speaker front	:	yes
motherboard	:	ATX or MATX
power supply	:	380 W